CPS Technologies To Exhibit at JEC Europe 2012

CPS to showcase HybridTech Armor® and Metal Matrix Structures at JEC Europe Composites Show in Paris, March 27 - 29, 2012

CPS Technologies Corporation (CPS) (OTC Bulletin Board: CPSH) today announced its participation in the JEC Europe Composites Show in Paris, March 27 - 29, 2012. The JEC Composites Show in Paris is the only trade show that unites the global composite industry in an international platform where users can find a full spectrum of processes, new materials, and composite solutions. The Show presents a diversified and well-balanced offering from more than 1,120 exhibiting brand names from around the world.

For more than 20 years, CPS has been a leading supplier of metal matrix components for thermal management of electronics. Now CPS also offers aluminum metal matrix composite (Al-MMC) encapsulated ceramic tile HybridTech Armor® as well as structural components primarily using fiber reinforcements. Our Al-MMCs tool box also includes hollow ceramic shell reinforcements creating syntactic foams, with density nearly half that of aluminum. Such syntactic foams can be combined with fiber reinforced layers to create unique Al-MMC structures. Current maximum size for Al-MMCs is approximately 1m x 2m x 20cm. At stand # Z44 in Pavilion 1, CPS will showcase its capability to make large net-shape components.

ABOUT CPS
CPS serves a portfolio of end markets with advanced material solutions, the most significant solution being metal matrix composites (MMCs). CPS has a proprietary, leading position in MMC, a class of materials which has several superior properties compared to conventional materials including improved thermal conductivity, thermal expansion matching, higher stiffness and lighter weight. CPS today, primarily providing electronics OEMs with thermal management components to increase performance and reliability. CPS AlSiC products are used as microprocessor lids, flip chip lids, heat sinks, microwave housings, optoelectronic housings, power substrates, IGBT baseplates, armor, and liquid cold plates. End applications include motion control (controller) power modules, high voltage PFC (power factor correction) front ends, pin fin coolers for IGBT modules in hybrid electric vehicles, hi-rel DC/DC converters, UPS (uninterruptible power supplies), and many others.

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Tags: Electronic Thermal Management Sy, Metal Matrix Composite, packaging solutions


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Ralph Norwood
Press Contact, Electronic Thermal Management System
Electronic Thermal Management System
111 South Worcester Street, Norton, MA
Norton, MA 02766
United States