Future Electronics Has Ready Stock of Sierra Wireless AirPrime Embedded Wireless Modules SL Series

Online, July 4, 2013 (Newswire.com) - Future Electronics, a global leading distributor of electronic components, announces immediate availability of the Sierra Wireless AirPrime Embedded Wireless Modules SL Series.

The AirPrime SL Series( http://www.futureelectronics.com/en/Search.aspx?dsNav=Ntk:PartNumberSearch%7cSL+Series%7c1%7c,Ny:True,Ro:0,Nea:True,N:4294880380-587 ) offers smart connectivity for consumer and industrial applications. Its standard 25 x 30 mm LGA (Land Grid Array) package allows fully automated manufacturing for high-volume production.

Available in multiple air interfaces versions (EDGE, HSDPA, HSPA+, CDMA 1xRTT and EV-DO), the AirPrime SL Series presents an easy upgrade path to next-generation network technologies.

With its application framework and cloud-based device management services, the smart AirPrime SL Series accelerates M2M deployment.

AirPrime SL Series modules have a solid track record in several M2M sectors such as transportation, energy, industrial, security, sales & payment, networking, field service and healthcare.

AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

Key features include an industry standard 25 x 30 mm LGA (Land Grid Array) package, available in version for: EDGE, HSDPA, HSPA+( http://www.futureelectronics.com/en/Technologies/Product.aspx?ProductID=MC77001101855SIERRAWIRELESS5031658 ), CDMA 1x and EV-DO, and an extended temperature range to support industrial applications.

Key benefits include being footprint compatible, offering an easy upgrade path between global 2G and 3G markets, and the ability to scale easily from one device to millions. In addition, there are lower deployment time and costs, as the LGA form factor allows high-volume automated production. M2M deployment and operations are simplified with application framework, development tools and pre-integrated secure cloud services.

To purchase product(s) or for more information about Sierra Wireless( http://www.futureelectronics.com/en/Search.aspx?dsNav=Ny:True,Nea:True,N:4294880380 )

Smart Modules, AirPrime, the SL Series, 2G wireless modules, 3G wireless modules, smart connectivity, the next-generation network, and cloud-based devices, along with access to the world's largest available-to-sell inventory, visit: www.FutureElectronics.com

About Future Electronics

Future Electronics is a world class leader and innovator in the distribution and marketing of electronic components. Having served the electronics industry for over 40 years, Future Electronics is uniquely positioned as the only truly global distributor of electronic components supporting customers of all sizes. Future Electronics currently operates in 169 locations in 42 countries in the Americas, Europe and Asia, with its corporate headquarters in Montreal, Canada. www.FutureElectronics.com

Media Contact

Martin H. Gordon
Director, Corporate Communications
FUTURE ELECTRONICS
www.FutureElectronics.com

514-694-7710 (ext. 2236)
Fax: 514-630-2671
[email protected]

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