Thermally & Electrically Conductive Adhesives Cure in Minutes With Revolutionary Snap-Curing System

Warwickshire, United Kingdom, November 6, 2015 (Newswire.com) - Manufacturers Panacol recently expanded their Elecolit® product portfolio. Thanks to new, innovative filling materials and optimized hardener systems, these newly developed adhesives with improved conductivity are now available. For maximimum processing speed, these adhesives can be applied by jetting.

Until recently, the curing of conductive adhesives was a slow process. Thanks to new hardener systems, conductive adhesives can be now cured within a few minutes. Several one-part Elecolit® conductive adhesives have been modified for snap-curing ability. New hardener systems in many of the one-part epoxy based adhesives develop a cure within minutes.

The new Elecolit® silver filled adhesives are both electrically and thermally conductive and available in a range of viscosities to accommodate various applications and requirements. As the conductivity is strongly dependent on the content of conductive filler, Panacol uses uniquely shaped filling materials to achieve an optimal fill ratio. This ensures high conductivity and consistent product performance.

The Elecolit® range Panacol provides an extensive Elecolit® product portfolio of one and  two part conductive adhesives suitable for: Shielding and ESD protection, Electrically conductive contacting and bonding of conducting paths within the electronic field, Electrically conductive bonding on circuit boards and PCBs, Die bonding and Flip chips.