Dorado, Inc. has announced that TSMC is using Dorado's TweakerTM ECO (Engineering Change Order) Platform for incremental optimization in TSMC's Integrated Signoff Flow (ISF).

Atrenta and imec have jointly developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs and will be demonstrating this flow at DAC in San Diego from June 6 - 8, 2011 at the Atrenta booth (1643).