AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation

AI Technology, Inc. (AIT) Increases Manufacturing Capacity of Advanced 10 Micron Wafer Level Die-Attach Film (DAF). AI Technology, Inc. (AIT) has just increased its manufacturing capacity to more than 10 million square feet.