Housing in a 66.5 x 130 x 100mm rugged aluminum chassis with DIN-rail mounting capability, FES2213 utilizes Atom N2600 Dual-core 1.6 GHz processor; provides diverse I/O and up to 4 GB DDR3 system memory.
Read MoreBased on Mobile QM67 Express Chipset, FES5312 and FES5313 are powered by 2nd Generation quad- or dual-core i7/i5/i3 CPU and serve in environments prone to shock, vibration, humidity, and temperatures from -22 to 140°F.
Read MoreFanless embedded computer BIS-6590, utilizing the next generation proprietary "ICEFIN" thermal design, is powered by Intel 2nd and 3rd GEN Sandy Bridge/Ivy Bridge Core i5/i3 as well as the Celeron CPUs and Intel H61/Q77/B75 based.
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