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Press Release
Oct 23, 2012
MEMS Wafer Capping and Wafer Spray Coating Papers Presented by Nordson ASYMTEK at IWLPC
Nordson ASYMTEK will present two papers, "Sealing Dispensing for MEMS Wafer Capping" and "Wafer Spray Coating for Pre-applied Underfill" at IWLPC 2012, in San Jose, CA, November 11-12.
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